UPCOMING DEADLINE FOR MEDEA+ CALL FOR PROJECT PROPOSALS May 10, 2006 has been defined as the deadline to submit the last proposals pertaining to the 5th MEDEA+ call opened on June 06, 2005.
Paris, 24 April, 2006 - Already submitted proposals reveal that MEDEA+, the EUREKA cluster programme for innovative European research and development in microelectronic technologies and applications will once again enlarge its number of collaborative partners from medium and small sized companies, from institutes, universities and academic institutions. "We are pleased with both the number of and the quality of projects submitted as part of this call," said Gérard Matheron director of the MEDEA+ Office. "With an average level of 2000 researchers/year involved in these projects, the industry’s continuous commitment to invest in innovation, research and development for the benefit of Europe at large is clearly demonstrated. And the quality of the proposals received is proof that Europe’s micro- and nanoelectronic industry is maintaining its high tech domains."
Though the MEDEA+ programme will end in 2008, this call will not be the last one of the programme. Another call will be opened in the last quarter of 2006, details of which will be announced in due course. And since resulting projects will most probably extend beyond 2008, respective time extensions will be granted by the EUREKA organization to all projects labelled by MEDEA+.
MEDEA+ TRIGGERING DEBATE ON A SUCCESSOR-PROGRAMME With industry driven programmes such as JESSI, MEDEA and MEDEA+, Europe’s capabilities in micro-/nanoelectronics R&D have been built up and Europe successfully managed to become a world player in a fierce competition capturing innovative domains. MEDEA+ being one of Europe’s key-enablers for innnovation and thereby for economic growth and employment, and ending in 2008 starts thinking about its future role and perception.
Barcelona, 22 November, 2005 - With more than 300 participants from all over Europe, MEDEA+ Forum 2005 held in Barcelona on November 21 and 22 has registered a peak of visitors and partners from industry, small and medium sized companies, from universities and institutes, from Public Authorities and Ministries. In his opening speech, MEDEA+ Chairman Arthur van der Poel draw a positive balance on the past 12 months. He noted that 350 partners from 21 countries have spent almost 14 000 person-years in the execution of 70 projects, whereby 34 of them have successfully ended already. He illustrated some project achievements, amongst those the 2005 – winner of the ‘Jean-Pierre Noblanc Award for Excellence’: the project Pocket Multimedia. Its results deliver excellent multimedia performance, consuming very low power whilst using multimedia processors, organic LED technology and tiny operating elements based on MEMs technology. The business perspectives are going far beyond initial expectations.
A vivid impression on MEDEA+ activities was given in the Poster- and Demo- sessions, where project leaders and experts presented latest achievements and technical results. Prominent keynote speakers gave their views on technical evolutions and market trends, both globally and with a particular emphasis on two very promising areas where Europe may gain importance: microtechnologies for lab-on-chip and security of the IT systems.
Today, PPPs (Private-Public-Partnerships) are considered as valuable instruments to help Europe facing the incoming competitiveness challenges through increased research, development and innovation in particular within industry. Means to make it happening were already existing at local/regional, national and European Community level, but the need for better collaboration of the various initiatives has been recently reactivated. MEDEA+ is actually an essential ring in the chain linking all innovation activities throughout Europe in the nanoelectronics domain.
For instance, MEDEA+ joined from the very beginning the preparation of European Technology Platforms (ETPs) proposed by the European commission in the Framework 7 to gather all the stakeholders in carefully selected areas. MEDEA+ is actively contributing to the set-up of ARTEMIS (Embedded Systems) and ENIAC (Nanoelectronics), the 2 ETPs closely related to MEDEA+ applications and technologies domains. The Strategic Research Agendas defined by ARTEMIS and ENIAC will serve as roadmaps for any R&D initiative in Europe.
In addition, there is a growing interest for reactivating national support in the form of PPPs aiming at focusing available resources in ‘geographic local clusters’, named in France for instance ‘Poles de Competitivite’. Those will have to be networked at the European level to address global markets and MEDEA+ or its successor programme may be instrumental for that purpose.
The debate on ‘Beyond MEDEA+’ is therefore open about its actual extension and technical content, but it is already clear that the synergism between the various schemes in preparation has to be established and that the MEDEA+ community will play a pivotal role there.
Paris, 20 September, 2005 - With the 5th release of the MEDEA+ Roadmap for Electronic Design Automation (EDA), key areas of design and research are highlighted keeping the European Semiconductor Industry on the leading edge and providing an intriguing glimpse into the future of Design Automation.
Approaching the era of nano structures it appears that the times of “happy scaling” are reaching their end. New design flow paradigms and strong links between System Level Design and Design for Manufacturability (DfM) are becoming mandatory to master new technologies and to slow down the increasing design gap which has persisted for many years.
This latest roadmap release joins prime knowledge of a network of European Design experts from industry, research institutes and universities and confirms that DfM and further progress in SoC and SiP are all amongst vital areas of research.
The new roadmap addresses these challenges and extends its scope to the MEMS domain that represents a major pillar of the “embedded systems driven” European Semiconductor Industry and the need for “Smart Systems Integration Technology”.
The roadmap is available for downloading from the MEDEA+ public website, but also available on CD-Rom on written request.
Paris, 6 June, 2005 - MEDEA+, the industry driven pan-European programme for innovation and advanced cooperative Research and Development in nano/ microelectronics (EUREKA S! 2365) is launching the next Call for project proposals (2nd call, 2nd phase), open from 06 June 2005 onwards. There is no specific closing date for the Call. As such, Project Outlines can be submitted at any time, and will be evaluated continuously. The 2nd Call is open to all work areas of MEDEA+ White Book 2, proposals pertaining to work areas so far not well covered by projects are more than welcome. It is the aim, that Project Outlines submitted until August 20, 2005, and subsequent Full Proposals, if found eligible, will have passed the full evaluation and selection process and will have received the MEDEA+ label before end of this year. It can be assumed that these projects will start in the first half of 2006.
MEDEA+ expects that an open Call with a continuous evaluation process of proposals will enable all stakeholders to better exploit synergies in trans-border cooperation. Related information and guidelines for preparation are accessible on the MEDEA+ public web-pages www.medeaplus.org.
Paris, 25 May, 2005 - Les Mesnuls (France), May 24-26, 2005 - In mass markets, application oriented design methods for “System on Chip” are an increasingly important success factor. They are decisive for productivity and earliest marketing. Exhaustive research and development in this area supported within MEDEA+ by public and private partnership is fundamental for a leadership position of Europe’s nanoelectronic manufacturers.
“What is at stake for Europe is to master the design and manufacturing of the most complex dedicated circuits in the most advanced technologies and with as short as possible time to market”, said Arthur van der Poel, MEDEA+ Chairman, when opening the conference. In front of almost 100 experts from industry, SMEs and academia van der Poel highlighted MEDEA+’s full commitment to EDA, emphasising that 20% of resources spent in the frame of the programme are currently dedicated to projects in design automation. In addition, an updated version of the MEDEA+ EDA Roadmap will be released in the second half of this year.
Two keynote speeches gave an inside view on EDA design integration into new nano-electronics processes as well as on mega trends of the semiconductor markets. The seven technical sessions of this year’s conference address platform based design, heterogeneous design and design for manufacturing, the latter becoming the main challenge in chip design when coming to structures below 45 nm. Accompanying tutorials highlight latest achievements of EDA issues in signal integrity and reliability, security applications, IP platforms, system level design and mixed signal verification and test.
MEDEA+, working presently on 12 EDA projects, gives an illustrative impression on how to manage both technical and economical challenges, thus safeguarding the electronics industry’s competitiveness in Europe.
EUROPEAN ADVISORY BOARD ON MASKLESS LITHOGRAPHY INSTALLED BY MEDEA+
Paris, 10 January, 2005 - Recently, MEDEA+ has installed a European Advisory Board on Maskless Lithography (EAB-ML2). The objective of this Board is to provide guidance to the various European initiatives on maskless lithography.
As lithography continues to drive Moore’s Law, the increasing mask costs tend to constrain the economic viability of new technology generations. Presently, several European consortia are in various stages of developing tools for maskless pattern definition. Different concepts are under development, based upon either particle optics or photons. Also a number of ideas on beam modulating devices are being tested. In all cases, effective and reliable imaging will require enormous data transfer rates.
The EAB-ML2 will serve as a platform for the exchange of ideas between suppliers and users, and explore application scenarios for the implementation of maskless lithography. The equipment manufactures represented in the EAB –ML2 are ASML, Leica Microsystems, and MAPPER Lithography. ASML aims at a maskless extension of the optical roadmap via optical mask-less lithography (OML). Leica and MAPPER champion mask-less multiple e-beam concepts. The semiconductor companies Infineon Technologies, Philips Semiconductors and STMicroelectronics represent the users’ side.
Mart Graef, chair of the EAB-ML2 said: “The expertise and skills that are needed to create maskless lithography tools are available in Europe. The involvement of the major European semiconductor manufacturers and semiconductor equipment companies will ensure that the solutions provided will be tuned to the requirements of the IC industry. This is the most important issue that we will address in the EAB-ML2”.
Peter Tischer, Vice Chairman of MEDEA+ added: “ Lithography is a large part of the MEDEA+ Programme. We estimate maskless lithography as a promising solution for low-volume IC products, maybe also for prototyping of new designs. Having different proposals for ML2 in Europe, the EAB-ML2 offers the chance to identify joint technical challenges and address them in collaborative work within the MEDEA+ Programme.”