The project focuses on future multi-band, multi-mode more efficient Power Amplifiers and Transmitter systems covering: integrated systems, discrete systems and distributed systems (collocated with antenna) applied to a set of target applications: cellular handsets (3/4G, mmWave) and Base Transceiver Stations (BTS) (3/4G), Avionics, mobile Satellite communication (Satcom) and home networking as well as specific Base Transceiver Stations, and addresses Software Defined Radio (SDR) roadblocks in order to assess at system level the PANAMA advances. Main common target is an efficiency gain for each application: 20% compared for integrated systems, 30% for discrete systems and 10% for distributed systems.

Hardwired SoC architectures suffer from a lack of flexibility regarding market evolution, resulting in an excessive design cycle time and increased cost. Furthermore, process variability is not yet well addressed for 32 nm and beyond. The objective of COBRA is to develop and experiment an open, flexible and high performance platform by substituting heterogeneous hardware/software subsystems by a regular array of processors. The platform will be driven by Telecom, Video and Multimedia benchmark applications and demonstrated on 32nm silicon with 3D stacking.

The overall objective of the project is to provide all needed HW and embedded SW components (together with their management procedures) aimed at ensuring and re-enforcing Privacy, Trust and Security of transactions in some Public critical infrastructures, Mobile Networks as well as in high-value ambient-intelligence scenarios pertaining to the emergence of the future “Internet of Things”.

This project aims at developing new HW and embedded SW devices that will fully comply with the next wave of computing and will fully integrate in both “ambient-intelligence” and “internet of things” scenarios. More precisely, the project will develop, prototype and experiment with new ways of establishing high-speed, secure bidirectional wireless communication channels and supporting new, intuitive and simple context-sensitive interactions between persons and objects belonging in the environment. Furthermore these interactions will by necessity preserve both the security and privacy of the transactions.

To address societal needs in the areas of healthcare, entertainment, and road & industrial safety. This project will lead to a number of societal benefits: higher efficiency, less errors in medical diagnostics, change from treatment to prevention; enhanced experience for TV viewers by unprecedented image quality; an additional pair of “automatic” eyes on the road; see more in a dark environment, improved recognition capabilities; improved safety and flexibility of assembly lines to safeguarding man and machine. Research topics are pixel design and modeling, low-noise analogue read-out including ADconversion and multiplexing, modeling of thermal-, optical- and electrical cross-talk, optics and correction algorithms for CMOS imager and optical enhancement. Of the many performance aspects of a CMOS imager HiDRaLoN will focus on increasing the dynamic range to 120dB and lowering the noise level with at least 50% to make CMOS imagers surpass today’s CCDs.

This project aims at developing optimised mitigations for advanced digital and power electronic systems in order to solve the major issue of their reliability against the increasing problem of soft, firm and hard errors. The expected deliverables are a set of validated mitigation techniques from layout to applications architecture levels, customised mitigations for given applications and a strong effort in standardisation. The expected benefits will be the capability to use advanced electronics in critical end-user applications, and ensure reliability of consumer electronic, especially for low power.

ICAF aims to research, develop, and demonstrate future image capture, processing and transmission technologies for Machine Vision (MV), Security/Surveillance and Professional Broadcast (PB).

This project aims at developing highly efficient, integrated and reliable power electronics technolo-gies for automotive, aeronautics and healthcare applications (Magnetic Resonance Imaging systems). The project covers the development of new technologies for discrete power components (IGBT’s, JFET, Diodes, based on wide band gap semiconductors), power cores, storage elements (supercapaci-tors), packaging for high temperature, thermal and EMC management solutions.

This project’s goal is to ensure system reliability by means of combination of design solutions for future complex SoCs as needed in applications like transportation, medical, and industrial automation. SoC complexity is rapidly increasing due to integration of new functions, devices, sensors/monitors and extended operating conditions. This and the shrinking dimensions of SoCs make them increasingly prone to failure.

Aims at breakthrough low-power design solutions for (data) communication-centric heterogeneous multi core architectures targeting 45nm and 32nm CMOS technologies. These architectures will be exploited in a number of future applications e.g. the next generation of programmable multi-processor mobile phones and mobile digital entertainment devices. COMCAS investigations concern the complete low-power design hierarchy looking at all aspects from system level choices, modelling of applications (algorithms, protocols) and architectures, maximize the reuse of existing IPs using the most appropriate tool chains, partitioning and mapping, cycle-accurate and bit-true virtual prototyping, minimal power design blending semi- and full custom circuit designs at transistor level in technologies of 45 nm and beyond.

Towards and incandescent free world, with replacements of inefficient halogen lamps; by developing opportunities in SSL and HID technology for general and automotive lighting.

The piezoMEMS Sensors and Actuators project (PiMSA) will research, develop, and introduce advanced piezoelectric MEMS technology into production for two applications: (1) People presence detection for lighting systems and (2) droplet control for inkjet printing. PiMSA is a focused cooperation of materials providers, designers, device fabricators, and application partners.

The projects aims at providing novel system methodologies, new design tool & system architecture solution to handle emerging 3D integration technologies for multimedia & mobile (M3) product. The 3DIM3 project will therefore enable the design, from system and architecture level to layout, of 3D integrated M3 products with higher performances, lower consumption smaller size/form factor at lowest cost.

This project aims at exploring and developing RFID-based sensor platform technology, which will be demonstrated in an intelligent package monitoring the environmental conditions of perishable goods in the supply chain between production and consumer and therefore guaranteeing a more effectively product's quality. The Pasteur project thereby addresses the need to increase on-line knowledge on the traceability of individual products and the demand to increase the accessibility of the information about these products for the consumer end-user. Key differentiators in the technologies to be developed are ultra-low power and extreme low cost.

The REFINED project aims at ensuring the continuation of Europe leadership in the field of embedded non volatile memories.
This leadership keeps European leading position in some areas like smart cards and to boost European participation to large markets like consumer and automotive controllers.
It brings together the main European R&D actors (semiconductor companies, research laboratories), in order to develop the 65 nm generation as well as improvements to the current 90 nm generation (shrink version).
The base for the next generation is also set along evolutionary approaches as well as more radical ones. Essential issues of reliability, testing and IP development are addressed in parallel.
The REFINED project aims to create fully integrated technology platforms for the embedding of NVM functions in sub-90nm CMOS technologies (process, demonstrator, test and reliability infrastructure) and in parallel to setup low cost effective solutions for qualified technologies.

UTTERMOST objective is to transform an initial 32nm research into a full fledge Technology Platform enabling design of IC products and their cost effective manufacturing in Europe.
The main goal of the UTTERMOST project is to develop advanced process modules, and validate a design platform (design kit, models, and libraries) for reliable and manufacturable digital CMOS 32nm and 28nm technologies on 300mm wafers in the 2 European manufacturing facilities of Crolles for STMicroelectronics, and Dresden for GLOBALFOUNDRIES.
The goal of UTTERMOST partners is to make 32/28nm digital technology available for design and industrial exploitation in Europe.

This project aims at developing a complete mature 3D integration technology platform covering the entire range of processes required from vertical interconnects (TSV, micro bumps…) and robust bonding to innovative packaging approaches to address a wide range of products.
The main objectives of this project is to achieve chip-level three-dimensional (3D) TSVintegration, Wafer-to-Wafer and Die-to-Wafer bonding, and packaging of stacked circuits, in order to create a complete technological platform for high performance and cost effective 3D systems manufacturing.
The objective of COCOA project is to define a robust 3D integration technology platform covering the existing gap between medium (104 cm-2) and high density (106 cm-2) technologies, including packaging of two or more stacked layers.

The goal of the EXEPT project is to develop technologies, tool& infrastructures components as required for high volume EUV lithography for 22nm node in 2012.The project aims with the expected introduction of EUV lithography in high volume semiconductor production lines at opening new business opportunities for the participating companies.

Test is the last chance to deliver quality and reliability to the end customer. A leap forward is required to incorporate test as a mindset in the total product creation.
The TOETS project has the ambition to create this breakthrough in methods and flow used by the test technologies by considering test in the WHOLE value chain from design to application.