The project focuses on future multi-band, multi-mode more efficient Power Amplifiers and Transmitter systems covering: integrated systems, discrete systems and distributed systems (collocated with antenna) applied to a set of target applications: cellular handsets (3/4G, mmWave) and Base Transceiver Stations (BTS) (3/4G), Avionics, mobile Satellite communication (Satcom) and home networking as well as specific Base Transceiver Stations, and addresses Software Defined Radio (SDR) roadblocks in order to assess at system level the PANAMA advances. Main common target is an efficiency gain for each application: 20% compared for integrated systems, 30% for discrete systems and 10% for distributed systems.

The overall objective of the project is to provide all needed HW and embedded SW components (together with their management procedures) aimed at ensuring and re-enforcing Privacy, Trust and Security of transactions in some Public critical infrastructures, Mobile Networks as well as in high-value ambient-intelligence scenarios pertaining to the emergence of the future “Internet of Things”.

This project aims at developing new HW and embedded SW devices that will fully comply with the next wave of computing and will fully integrate in both “ambient-intelligence” and “internet of things” scenarios. More precisely, the project will develop, prototype and experiment with new ways of establishing high-speed, secure bidirectional wireless communication channels and supporting new, intuitive and simple context-sensitive interactions between persons and objects belonging in the environment. Furthermore these interactions will by necessity preserve both the security and privacy of the transactions.

To address societal needs in the areas of healthcare, entertainment, and road & industrial safety. This project will lead to a number of societal benefits: higher efficiency, less errors in medical diagnostics, change from treatment to prevention; enhanced experience for TV viewers by unprecedented image quality; an additional pair of “automatic” eyes on the road; see more in a dark environment, improved recognition capabilities; improved safety and flexibility of assembly lines to safeguarding man and machine. Research topics are pixel design and modeling, low-noise analogue read-out including ADconversion and multiplexing, modeling of thermal-, optical- and electrical cross-talk, optics and correction algorithms for CMOS imager and optical enhancement. Of the many performance aspects of a CMOS imager HiDRaLoN will focus on increasing the dynamic range to 120dB and lowering the noise level with at least 50% to make CMOS imagers surpass today’s CCDs.

This project aims at developing optimised mitigations for advanced digital and power electronic systems in order to solve the major issue of their reliability against the increasing problem of soft, firm and hard errors. The expected deliverables are a set of validated mitigation techniques from layout to applications architecture levels, customised mitigations for given applications and a strong effort in standardisation. The expected benefits will be the capability to use advanced electronics in critical end-user applications, and ensure reliability of consumer electronic, especially for low power.

Nightingale focuses on Point Of Care terminals in the home or clinic for the management of one or more chronic diseases with support for acute incident handling. Nightingale will focus the technology strengths of Europe major systems houses, semiconductor industry and institutes on the nanotechnologies needed for personalised medicine delivered in Care Cycles for individuals. Nightingale brings together the partners technologies’ for Telecare i.e personalized medical therapies, with the systems needed to deliver personal care by medical organisations as part of a programmed Care Cycle. Nightingale supports the emerging standards with necessary IPR to develop products and services that can be commercially exploited by the partners.

This project aims at developing highly efficient, integrated and reliable power electronics technolo-gies for automotive, aeronautics and healthcare applications (Magnetic Resonance Imaging systems). The project covers the development of new technologies for discrete power components (IGBT’s, JFET, Diodes, based on wide band gap semiconductors), power cores, storage elements (supercapaci-tors), packaging for high temperature, thermal and EMC management solutions.

Aims at breakthrough low-power design solutions for (data) communication-centric heterogeneous multi core architectures targeting 45nm and 32nm CMOS technologies. These architectures will be exploited in a number of future applications e.g. the next generation of programmable multi-processor mobile phones and mobile digital entertainment devices. COMCAS investigations concern the complete low-power design hierarchy looking at all aspects from system level choices, modelling of applications (algorithms, protocols) and architectures, maximize the reuse of existing IPs using the most appropriate tool chains, partitioning and mapping, cycle-accurate and bit-true virtual prototyping, minimal power design blending semi- and full custom circuit designs at transistor level in technologies of 45 nm and beyond.

Towards and incandescent free world, with replacements of inefficient halogen lamps; by developing opportunities in SSL and HID technology for general and automotive lighting.

The objective of the Homedia project is to specify, architect and demonstrate an innovative user-centric Digital TV receiver concept that will: Hide the complexity of the distribution of the multiple digital TV programs to the user and give him a simplified user-friendly view of it, Enable storage of multiple simultaneous programs as well as viewing while recording and time-shifting, Distribute the broadcast programs or stored contents within home via the emerging novel communication technologies like Ethernet over HDMI 1.4, high-speed PLC, DisplayPort 1.2, Achieve low-power consumption through the inclusion of power-management functionalities.

The projects aims at providing novel system methodologies, new design tool & system architecture solution to handle emerging 3D integration technologies for multimedia & mobile (M3) product. The 3DIM3 project will therefore enable the design, from system and architecture level to layout, of 3D integrated M3 products with higher performances, lower consumption smaller size/form factor at lowest cost.

The goal of the EXEPT project is to develop technologies, tool& infrastructures components as required for high volume EUV lithography for 22nm node in 2012.The project aims with the expected introduction of EUV lithography in high volume semiconductor production lines at opening new business opportunities for the participating companies.

Test is the last chance to deliver quality and reliability to the end customer. A leap forward is required to incorporate test as a mindset in the total product creation.
The TOETS project has the ambition to create this breakthrough in methods and flow used by the test technologies by considering test in the WHOLE value chain from design to application.